Monday, September 16, 2013

SILVER RECOVERY SYSTEMS AND WASTE REDUCTION IN PHOTOPROCESSING

SILVER RECOVERY SYSTEMS AND WASTE REDUCTION IN PHOTOPROCESSING

There are several reasons to be interested in the recovery of silver from photoprocessing waste. Silver is a valuable natural resource of finite supply, it has monetary value as a recovered commodity, and it's release into the environment is strictly regulated. In photoprocessing, silver compounds are the basic light-sensitive material used in most of today's photographic films and papers. During processing, particularly in the fixing bath or bleach-fix, silver is removed from the film or paper and is carried out in the solution, usually in the form of a silver thiosulfate complex.
Major sources of recoverable silver are: photoprocessing solutions, spent rinse water, scrap film, and scrap printing paper. As much as 80 percent of the total silver processed for black and white positives and almost 100 percent of the silver processed in color work will end up in the fixer solution. Silver is also present in the rinse water following the fixer or bleach-fix due to carry-over.
Economic considerations include initial equipment cost, the amount and value of silver recovered, and the return on investment. Space and energy requirements, day-to-day attention required, maintenance, and reliability are also important. It is necessary to know the amount of silver available for recovery, the total volume of fixer and bleach-fix solutions used in processing, and the expected performance of the recovery method under consideration.
Several technologies exist for recovering silver onsite. The most common methods of onsite recovery from the fixer and bleach-fix processing solutions involve metallic replacement, electrolytic recovery and chemical precipitation. Ion exchange and reverse osmosis are other methods that can be used alone or in combination with conventional silver recovery systems. However, these are generally considered suitable only for dilute solutions of silver. A silver recovery system can be devoted to a single process line or can be used to remove silver from the combined fixer from several process lines in a plant.
The most widely used silver recovery method for large operations is electrolysis, where the silver is recovered from solution by electroplating it on a cathode, Fig. 1. A controlled, direct electrical current is passed between two electrodes suspended in the silver-bearing solution. Silver is deposited on the cathode in the form of nearly pure silver plate. The cathodes are removed periodically, and the silver is stripped off for sale or reuse. While this method requires a substantially larger capital expenditure and needs an electrical connection it does have the advantage over other methods in that it yields virtually pure silver. This results in lower refining and shipping costs and it does not contaminate the fixer, thereby permitting its reuse for some processes. When properly operated, 95 percent of the potential available silver can be recovered. Combining electrolytic silver recovery with in-situ ion exchange can result in more than 99.5 percent silver recovery efficiency.
A recirculating electrolytic recovery system has advantages over systems that only remove silver. Silver is removed from fixer solution by the recovery cell which is connected "in line" as part of a recirculation system. Fixer solution reclaimed by electrolytic silver recovery can have limited reuse in the photoprocess. By recirculating the desilvered fixer to the in-use process tank, less fresh fixer solution is needed to replenish the bath. Fixer replenishment can be reduced 20 percent or more without degradation of product quality. Chemical replenishment can be managed through the frequent and consistent use of test strips. A properly designed recirculating system can lower the silver in the fixer from a concentration of 1 ounce/gal. to 1 ounce/100 gals. The amount of silver carried over to the rinse water is similarly reduced.

Metallic replacement requires little capital expenditure for equipment and requires only a few simple plumbing connections. The equipment consists of a plastic container, a plastic-lined steel or stainless steel drum filled with metal, usually steel wool, and some plastic hose and plumbing connections.
See Fig. 2. Silver is recovered when the silver-bearing solution flows through the cartridge and makes contact with the steel wool. The iron goes into solution as an ion, and the metallic silver is released as a solid to collect in a sludge at the bottom of the cartridge or is deposited on the steel wool. The yield a user can expect is determined by the silver concentrations in solution, the volume of solution that is run through the cartridge, and the care with which the operation is managed. When silver is no longer effectively removed, the silver-bearing sludge is sent to a refiner who will refine it and pay the customer for the recovered silver.
 


















Figure 1. Diagram of an electrolytic silver recovery cell




Figure 2. Diagram of a metallic replacement silver recovery cartridge.
The disadvantages of these two methods are that neither can recover more than 95 percent of the silver from concentrated solutions, effectively treat dilute wastewater, nor remove other metals from the effluent.
Another option is chemical precipitation with sodium sulfide, sodium borohydride or sodium dithionite. This can remove virtually 100 percent of the silver and most other metals from photographic effluent. With the addition of alkaline sodium sulfide and the resulting precipitation of silver sulfide, levels of soluble silver below 0.1 mg/L are possible. However, the more difficult part of the process is the separation of the precipitate from the liquid. Total silver levels of 0.5 to 1.0 mg/L are usually obtained due to filtration limitations. This process requires only a small capital expenditure and uses chemicals which are relatively inexpensive. It is not as widely used as the electrolytic or metallic replacement methods because of the inconvenience of handling large amounts of chemicals, the separation process required, and the problem of concentrating finely precipitated silver sulfide particles into a sludge that can be dried and refined. Also, careful pH control is required to avoid generation of highly toxic hydrogen sulfide gas.
 
Figure 3. Ion exchange system.
Ion exchange is generally used for effective recovery of silver from rinse water or other dilute solutions of silver. The ion exchange method involves the exchange of ions in the solution with ions of a similar charge on the resin. The soluble silver thiosulfate complex is exchanged with the anion on the resin. This exhaustion step and is accomplished by running the solution through a column containing the resin, Fig. 3. For large operations, the next step is the regeneration step in which the silver is removed from the resin column with a silver complexing agent such as anmnonium thiosulfate. This step includes several backwashes to remove particulate matter and excess regenerant before the next exhaustion step is initiated. Silver is then recovered from the thiosulfate regenerant with an electrolytic recovery cell. For smaller operations an alternative to performing the regeneration step onsite would be to remove the resin from the column and send it to a refiner for silver reclamation. Important factors in considering an ion exchange system for silver recovery are; selection of the resin, flow rate of the silver-bearing solution, column configuration, and selection of the regenerant. It has been demonstrated that the use of ion exchange can reduce the silver concentration in photographic effluent to levels in the range of 0.5 to 2 mg/L and can recover over 98 percent of the available silver. If this method is used as a tailing method after primary recovery by electrolysis, levels in the range of 0.1 to 1 mg/L can be obtained. Reverse osmosis (RO) is also used for dilute solutions. RO uses high pressure to force the silver-bearing solution through a semipermeable membrane to separate larger molecules, such as salts and organics, from smaller molecules like water. The extent of separation is determined by membrane surface chemistry and pore size, fluid pressure, and wastewater characteristics. For removal of silver, after-fix rinse water is flow-equalized, filtered, and pumped through an RO unit. Once the silver is separated from the water in this manner it can be recovered by conventional means such as metallic replacement, electrolytic recovery or chemical precipitation. Operating problems include fouling of the membrane and biological growth.
Evaporation is another option for managing waste photographic solutions. The wastewaters are collected and heated to evaporate all liquids. The resulting sludge is collected in filter bags. These bags can be sent to a silver reclaimer for recovery. The major advantage of the evaporation technique is it achieves "zero" water discharge. This method would be useful to operations that do not have access to sewer connections or wastewater discharge. A disadvantage is that the organics and ammonia in the waste solution may also be evaporated, creating an air pollution problem. A charcoal air filter may be necessary to capture the organics. Filter purchase, disposal, and electrical power add to operating costs.
An alternative to onsite recovery is to collect the bleach/fix in containers and have a silver recovery contractor haul it away to reclaim the silver. For this service the photolab may be paid only about 20 percent of the silver value. This low percentage may be partially offset by its high silver recovery yield. Off site recovery can be done on a larger, more efficient scale than onsite recovery. The small quantity generator or the generator who desires a minimum commitment may find advantages in off site services.
Silver can be recovered from scrap film and paper by soaking the material in spent fixer solution. Once dissolved in the fixer, the silver can be recovered through any of the silver recovery processes used by the lab. There are also businesses which will buy scrap photographic film and paper from the photoprocessor.
There are additional actions that should be considered by photolabs to minimize waste.
  • Inventory of chemicals should be controlled so that they are used before their expiration date.
  • Solutions should be made up only in quantities to meet realistic processing volumes .
  • Floating lids should be used on developer solution tanks to prevent evaporation and loss of potency.
  • Silver recovery unit operating conditions should be carefully monitored and maintained within vendor specifications.
  • Spent rinse water can be treated to restore purity and recycled for rinsing.
  • The use of squeegees can reduce considerably the amount of liquid carried out of the solution by the film.
  • Common sense safeguards such as keeping the mixing area clean, avoiding mixing of dry chemicals where airborne particles can cause contamination of other solutions, and use of separate mixing tanks for developers will minimize contamination or errors in mixing.
  • Counter-current rinsing can be used to reduce water consumption. The basic concept of counter-current rinsing is to use the water from previous rinsings to contact the film at its most contaminated stage. Fresh water enters the process only at the final rinse stage.
  • Bleach, bleach-fix, fix, and developer can be recycled and reused.

Saturday, September 14, 2013

A new material could make the sensors found in smartphones compatible with the human body.

Microscopic sensors and motors in smartphones detect movement, and could one day help their cameras focus. Now scientists have devised components for these machines that are compatible with the human body, potentially making them ideal for use in medical devices such as bionic limbs and other artificial body parts, researchers say.

The technology is called micro electromechanical systems, or MEMS, and involves parts less than 100 microns wide, the average diameter of a human hair. For example, the accelerometer that tells a smart phone if its screen is being held vertically or horizontally is a MEMS sensor; it convert signals from the phone's environment, such as its movement, into electrical impulses.
MEMS actuators, which may focus your next smartphone's camera, work in the opposite way, by converting electrical signals into movement.

MEMS are typically produced from silicon. But now researchers have devised a way to print highly flexible parts for these micro-machines from a rubbery, organic polymer more suitable for implantation in the human body than is silicon.
The new polymer is attractive for MEMS because of its high mechanical strength and how it responds to electricity. It is also nontoxic, making it biocompatible, or suitable for use in the human body.
The method the scientists used to create MEMS components from this polymer is called nanoimprint lithography. The process works much like a miniaturized rubber stamp, pressing a mold into the soft polymer to create detailed patterns, with features down to nanometers, or billionths of a meter, in size. The scientists printed components just 2 microns thick, 2 microns wide and about 2 centimeters long.
"The printing actually worked, that is to say that we were able to get the recipe right," researcher Leeya Engel, a materials scientist at Tel Aviv University in Israel, told LiveScience. "Fabrication at small scales is a very tricky business, especially when using new materials."
The fact that nanoimprint lithography does not rely on expensive or cumbersome electronics makes the new process simple and cheap.
"The use of new, soft materials in micro-devices stretches both the imagination and the limits of technology, but introducing polymer MEMS to industry can only be realized with the development of printing technologies that allow for low-cost mass production," Engel said.
Scientists have previously created biocompatible MEMS parts, Engel noted, but her team's method offers an advantage: it can manufacture these biocompatible parts quickly and inexpensively.
"Other methods, especially when you want to reduce the scale below a micron, can get very expensive and take a long time," Engel said.
For example, using an electron beam to create a large array of MEMS parts "might take running the machine all night, which is very costly," Engel said. "The process we reported took about 15 minutes."
As a bonus, MEMS parts made from this organic polymer are highly flexible; they may be hundreds of times more flexible than such components made from conventional materials. This flexibility could make, for example, MEMS sensors more sensitive to vibrations and MEMS motors more energy efficient, leading to better cameras and smartphones with longer battery lives.
The researchers now plan to manufacture functional devices constructed nearly entirely out of the polymer.
"If the printing processes really do allow for mass production of polymer devices, then we will be looking at the possibility of devices so cheap that they can even be disposable," Engel said.
 

Device Can Calm Dogs' Separation Anxiety - Invention by 13 year old Girl

Brooke Martin, 13, was inspired by her dog Kayla (both shown here) to invent iCUPpooch, a device that allows video chat and treat dispensing remotely to keep separation anxiety at bay.

Brooke Martin's golden retriever Kayla hated being left alone, and Martin, now 13, wanted to help her. She wondered: "What if you could talk to your dog if you were gone?" and "What if you were able to give them a treat while you were away?"
Then the answer came to her: video chat and dog treats dispensed remotely.
Her invention, called iCUpooch, has earned her a spot competing against nine other finalists in a young scientist competition for middle-school students. These finalists, selected based on their short video presentations, are collaborating with mentors over the summer before heading to the final competition in St. Paul, Minn.
 

Definition of buffer in digital electronics?What is the advantages of buffer circuits in digital electronics?

Definition of buffer in digital electronics?

A buffer is a means of isolating a signal source circuit from the loading circuit. They are generally needed when the signal source does not have sufficient capacity to deliver the current demanded by the load circuit. If buffers are not used, a problem called input loading results and this may cause the circuit to malfunction or to become damaged.
In digital circuits, the buffers reproduce the sequence of 1's and 0's received from one circuit and make them available to another circuit at a higher power level. A buffer is like a non-inverting amplifier with a gain of unity.

 

What is the advantages of buffer circuits in digital electronics?

buffer circuits helpful in overcoming the impedance matching problem.for example if we want to send a signal from one devise to other ,if there is no impedance matching between this two then signal is not transfered.now if we use buffer in between these two devises then the buffer without changing the signal shape or value it simply transffers the signal.

 

What are the application of buffer circuit in Electronics?

One prominent application is this: 

Some circuits have an output impedance very high. If these circuits are coupled with another circuit of low input impedance, the desired functionality of the latter circuit will be drastically affected. Because the first circuit tries to deliver large voltage to the second and the second invariably requires small input voltage. 

To avoid the circuit disfunctionality, a buffer circuit (a circuit with high i/p impedance and a low o/p impedance) is used. 

Another application is in the delay matching. This is an advanced topic though. The technology is still new. 
In delay matching, the latter circuit requires a delay of say "n" seconds after the first circuit's output. A buffer circuit is used in such cases also. The circuit design is totally different than the impedance matching case.

 

What are the pharmaceutical and biological applications of buffer?

when we want to know how much time the tablet will take to disuntegrate in stomach we use pH 1.2 buffer.

 

Examples of Buffering agent in pharmaceutical ingredients?

sodium acetate tyihydrate

 

 

 

 

Upcoming latest technologies in electronic communication

Daily new inventions are invented. Great products are launched every day. Its very important to get in touch with the latest happening in the world otherwise we will be left far behind than others.Do you wants to get latest technologies and news in Engineering world, then keep in touch with our blog.Upcoming latest technologies in electronic communication will help you learn lot.

Wednesday, September 11, 2013

B.Tech. (Electronics Engineering) - Course Details

In India, electronics is one of the fastest-growing industries. The program aims to impart expert knowledge in electronics engineering with special focus on design, analysis and manufacturing of electronic devices and components, integrated circuits, wireless devices, digital and analogue working of electronic circuitry for numerous applications.

Semester I
·         Physics I
·         Engineering Graphics
·         Mathematics I
·         Computer Science
·         Communication Workshop 1.1
·         Workshop Technology
·         Practical
·         Physics Lab I
·         Engineering Graphics Lab I
·         Computer Lab
·         Engineering Workshop
·         Language Lab

SEMESTER II
·         Physics II
·         Chemistry
·         Mathematics II
·         Basics Electrical Engineering
·         Communication Workshop 1.2
·         Environmental Studies
·         Practical
·         Electrical  Lab
·         Chemistry Lab
·         Physics Lab II
·         Language through Literature

SEMESTER III

·         Mathematics III
·         OOPs using C++
·         Signals & Systems
·         Electronic Devices & Circuits (EDC)-I
·         Network Theory
·         Communication Workshop 2.0
·         Practical
·         OOPs using C++ Lab
·         Electronics & Devices Circuits Lab-I
·         Network Lab
·         Electronics Workshops

SEMESTER IV

·         Electromagnetic Field Theory
·         Instrumentation & Measurement
·         Digital Electronics
·         Electronic Devices & Circuits (EDC)-II
·         Applied Numerical Methods
·         Probability and Random Variablesli>
·         Practical
·         Instrumentation & Measurement Lab
·         Electronics and Devices Circuits Lab-II
·         Digital Electronics Lab

SEMESTER V

·         Linear Integrated Circuits
·         Antenna & Wave Propagation
·         Microprocessor and Peripherals
·         Analog Communication
·         Power Electronics & Derives
·         Digital IC Applications
·         Communication Workshop 3.0
·         Practical
·         Analog Communication Lab
·         Microprocessor Lab
·         Linear Integrated Circuit  Lab
·         Electrical Drives and Electronics Lab
·         Minor Project I

SEMESTER VI

·         Microwave Engineering
·         Control System Engineering
·         Digital Signal Processing
·         Digital Communication
·         VLSI Technology & Processes
·         Practical
·         Advanced Microprocessor   Lab
·         Digital Communication Lab
·         DSP & MATLAB Lab
·         Microwave & Antenna Lab
·         Industrial Visit
·         Minor Project II
·         Comprehensive Viva I

SEMESTER VII

·         VLSI Design
·         Wireless Communications
·         Artifical Intelligence
·         Elective I (choose any one)
·         Optical Communication
·         Remote Sensing
·         Solar Cell Technology
·         Nano Electronics Technology
·         Satellite Communication
·         Telecommunication Switching Systems & Networks
·         Practical
·         VLSI Lab
·         Major Project I
·         Seminar
·         Industrial Training

SEMESTER VIII

·         Micro Electro Mechanical Systems
·         Industrial Automation
·         Industrial Management
·         Elective II(choose any one)
·         VHDL
·         Radar Systems
·         Multimedia Systems
·         Biomedical Instrumentation
·         Broadband Wireless Communication
·         Microcontroller & embedded system
·         Practical
·         Major Project II